Total Semiconductor Solution Material
Products
Wire
Bonding Wire
Product Description
A core material in semiconductor assembly processes, bonding wire connects silicon chips to lead frames, enabling electrical signal transmission within semiconductor devices.
Requires advanced technology due to its extremely fine diameter (approximately 1/4 the thickness of a human hair), along with high strength and long-term reliability.
Key Materials
Au Wire (Gold Bonding Wire)
Gold wire offers excellent bondability, high reliability, and corrosion resistance, accounting for over 90% of bonding wire demand.
Au (Ag) Alloy Wire (MR Type)
Au-Ag alloy wire contains approximately 10% silver (Ag), providing relatively lower material cost compared to pure Au wire, along with superior loop stability at high temperatures.
Cu Wire
Compared to Au wire, copper wire has lower material cost and offers higher electrical conductivity and strength. Stability is improved by controlling impurities and adding appropriate dopants.
Classification
By Purity
Classified based on material purity, such as 4N (99.99%) and 3N (99.9%).
By HAZ Length
Classified into High loop, Middle loop, and Low loop depending on the type and amount of added elements.
