Total Semiconductor Solution Material
Products
Target
EMI Sputtering
Product Description
EMI Sputtering Targets are target materials used to deposit thin metallic films that block electromagnetic interference (EMI) in semiconductor packages and other electronic devices.
EMI Sputtering Targets are key materials for forming high-quality, highly uniform thin films and play an essential role in improving the reliability and performance of electronic products.
Key Materials
Cu
SUS
Titanium
Features
Application Fields
Used as a target for PVD (Physical Vapor Deposition) processes for EMI shielding in electronic devices such as smartphones and semiconductor packages.
Key Advantages
Satisfies various process requirements, including 400°C heat resistance, maintenance of adhesion, low outgassing, retention of adhesive strength even after 2 hours at 200°C, and no residue.
Process & Application
In the sputtering process, ions are collided with the target surface to deposit a metal thin film onto the substrate.
Using state-of-the-art equipment such as dual-rotating chambers, we enhance thin-film uniformity and efficiency, allowing for precision deposition on various areas, including package corners.
